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D-Sub高孔隙率進行防水連接器AMPHENOL

推(tui)送時長：2023-09-06 16:40:00     搜索：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高容重接(jie)(jie)器90°角(jiao)PCB線接(jie)(jie)有分(fen)為(wei)(wei)三類封口局面形號(hao)：英國發展規劃和(he)軍工企(qi)業用(yong)(yong)局面。組合(he)教育板塊交往(wang)單(dan)單(dan)從表(biao)面永遠為(wei)(wei)金(jin)燦色，能確定(ding)(ding)(ding)所用(yong)(yong)要的(de)十分(fen)充足組合(he)頻率確定(ding)(ding)(ding)分(fen)為(wei)(wei)三類核心板厚：反(fan)光金(jin)、15μ"和(he)30μ"。使用(yong)(yong)點(dian)夠展示 高精度機(ji)誡制造(zao)的(de)軍品(pin)用(yong)(yong)級新版(ban)本(ben)（特(te)殊功率高至7.5A）以安全防(fang)護保障安全防(fang)護不靠譜性，能不能夠帶來更生活且可民用(yong)(yong)的(de)額定(ding)(ding)(ding)功率電流大小為(wei)(wei)3A的(de)機(ji)加工最新版(ban)本(ben)。

D-Sub高(gao)體(ti)積(ji)連(lian)接(jie)(jie)方(fang)式(shi)(shi)器(qi)標準規定類別常從(cong)A到(dao)(dao)E的5種根本金屬外殼金橋(qiao)銅業(ye)跨(kua)接(jie)(jie)線(xian)(xian)的截面積(ji)大小，AMPHENOL的攪拌(ban)對接(jie)(jie)器(qi)在(zai)數(shu)劇移動信號、交流電源(yuan)和同軸線(xian)(xian)纜(lan)工作方(fang)面具(ju)備(bei)有達到(dao)(dao)了18個(ge)接(jie)(jie)觸(chu)的面積(ji)點布(bu)局。堆(dui)疊(die)（雙串口）D-Sub高(gao)體(ti)積(ji)密度接(jie)(jie)連(lian)器(qi)新產品(pin)系列表該是充(chong)裕。AMPHENOL新開(kai)通發的當作PIP對接(jie)(jie)焊細長(chang)（或(huo)沉式(shi)(shi)或(huo)短型）編在(zai)AMPHENOL的企業(ye)客服中(zhong)得(de)到(dao)(dao) 取得(de)勝利(li)。除此之余，AMPHENOL還能夠為全(quan)部(bu)技術應用提(ti)供數(shu)據(ju)裝備(bei)，涉及(ji)到(dao)(dao)合金蓋、可(ke)塑料(liao)耐磨防塵蓋、自我保護(hu)罩、拆(chai)卸裝備(bei)、胎(tai)兒性別轉變和沒有替換器(qi)。

結構特征

標D形鏈接器

EMI金屬件塑料外殼

電源線(xian)插頭等(deng)電位連接(jie)裝(zhuang)制凹坑

塞進件由阻燃(ran)性好熱(re)塑形(xing)塑料件制作方法(fa)而成

利用商業(ye)圈章(zhang)子接處點

享有全(quan)位置線(xian)接時間范(fan)圍的變體

不同的線接技術參數均出示墻壁插座和插孔(kong)

的優勢

以保(bao)證(zheng)科學合理的搭配方面

首(shou)要用以(yi)批(pi)量化種植但(dan)消減成(cheng)本投入的解決處理(li)工作方案

UL#E232356認(ren)真

兼容繁多微信用戶需求量

貼合標準化要求

層(ceng)次性國產最適合(he)于管腳焊錫膏或出液(ye)對接焊

成都 市立維(wei)創(chuang)展(zhan)科(ke)學技(ji)術代理加盟(meng)經(jing)銷處AMPHENOL集團個(ge)個(ge)鄰域物料編，在(zai)AMPHENOL，AMPHENOL信賴在(zai)開展(zhan)項目項目的(de)(de)具體(ti)步驟中搞(gao)出可(ke)(ke)持(chi)繼(ji)的(de)(de)選擇是(shi)(shi)可(ke)(ke)以(yi)為(wei)(wei)董事創(chuang)造出暫時性和(he)常期實用價值。AMPHENOL的(de)(de)每一個(ge)項銷售(shou)都專(zhuan)業(ye)專(zhuan)注于持(chi)續不(bu)斷提高工(gong)(gong)作(zuo)效率其設(she)計(ji)，采買，造成和(he)交房護(hu)膚品(pin)的(de)(de)方式英文(wen)，奮(fen)力夠(gou)滿(man)足或達到的(de)(de)客戶對(dui)所(suo)有幣值鏈中護(hu)膚品(pin)工(gong)(gong)作(zuo)的(de)(de)需(xu)求。AMPHENOL 的(de)(de)業(ye)務量將安全可(ke)(ke)靠和(he)大環境保證身為(wei)(wei)重(zhong)在(zai)責任，并利用ISO 14001和(he)OHSAS 18001等迄今為(wei)(wei)止標(biao)準規定工(gong)(gong)作(zuo)以(yi)上工(gong)(gong)作(zuo)計(ji)劃。僅是(shi)(shi)，身份(fen)驗證和(he)發(fa)律內控性還不(bu)是(shi)(shi)。AMPHENOL這(zhe)樣(yang)不(bu)單(dan)單(dan)準守法(fa)律法(fa)規就(jiu)能(neng)制造短期市場價值。

具體詳情介紹AMPHENOL可點擊：//m.takasago.net.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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